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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Author(s): John H. Lau, Yi-Hsin Pao
Edition: 1
Publish Date: 1996 Publisher: McGraw-Hill Professional Format: Hardcover ISBN 10: 0070366489
ISBN 13: 9780070366480
Edition: 1
Publish Date: 1996 Publisher: McGraw-Hill Professional Format: Hardcover ISBN 10: 0070366489
ISBN 13: 9780070366480
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